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Describes the objectives of the Hong Kong Science Park (HKSP). A HKSP engineer explains the design concept behind the Park's Phase II development, shows the energy-saving features of its buildings, how they are insulated from vibration, how the advanced refuge handling system works and what the interactive multi-media intercom system offers. Chuck Cheng Cheuk-wing (President and Chief Executive Officer, Appotech Limited) tells why he returns from the United States to start his integrated circuit design business here and how facilities at the HKSP and availability of related research companies in the same complex help him and his staff in their work
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